Wafer-level MEMS packaging via thermally released metal-organic membranes
Autor: | Farrokh Ayazi, P. Monajemi, P.J. Joseph, Paul A. Kohl |
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Rok vydání: | 2006 |
Předmět: |
Microelectromechanical systems
Materials science Packaging engineering business.industry Mechanical Engineering Gyroscope Electronic Optical and Magnetic Materials law.invention Resonator Surface micromachining Mechanics of Materials law Q factor Electronic engineering Optoelectronics Wafer Electrical and Electronic Engineering Thin film business |
Zdroj: | Journal of Micromechanics and Microengineering. 16:742-750 |
ISSN: | 1361-6439 0960-1317 |
DOI: | 10.1088/0960-1317/16/4/010 |
Popis: | This paper reports on the design, implementation and characterization of wafer-level packaging technology for a wide range of microelectromechanical system (MEMS) devices. The encapsulation technique is based on thermal decomposition of a sacrificial polymer through a polymer overcoat to form a released thin-film organic membrane with scalable height on top of the active part of the MEMS. Hermiticity and vacuum operation are obtained by thin-film deposition of a metal such as chromium, aluminum or gold. The thickness of the overcoat can be optimized according to the size of the device and differential pressure to package a wide variety of MEMS such as resonators, accelerometers and gyroscopes. The key performance metrics of several batches of packaged devices do not degrade as a result of residues from the sacrificial polymer. A Q factor of 5000 at a resonant frequency of 2.5 MHz for the packaged resonator, and a static sensitivity of 2 pF g −1 for the packaged accelerometer were obtained. Cavities as small as 0.000 15 mm 3 for the resonator and as large as 1 mm 3 for the accelerometer have been made by this method. (Some figures in this article are in colour only in the electronic version) |
Databáze: | OpenAIRE |
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