Micro bonding with non-viscous adhesives

Autor:	Stefan Böhm, Klaus Dilger, Gregor Hemken, Jan Wrege, W. Ma, Sven Rathmann, Elisabeth Stammen, Juergen Hesselbach
Rok vydání:	2006
Předmět:	Microelectromechanical systems Molten state Materials science Adhesive bonding Hardware and Architecture Microsystem Batch processing Mechanical engineering Nanotechnology Adhesive Electrical and Electronic Engineering Condensed Matter Physics Electronic Optical and Magnetic Materials
Zdroj:	Microsystem Technologies. 12:676-679
ISSN:	1432-1858 0946-7076
Popis:	The new subproject B8 “Adhesive processing in batch technology for the manufacturing of microsystems” has the goal to compile bases for batchable joining techniques based on adhesive systems. This paper presents an alternative adhesive bonding system, which is able to join very small parts as well as relatively big parts with high accuracy requirements. The main advantages are the possibility to apply small volumes, to pre-apply the adhesive with a temporarily delayed joining procedure and extremely short set cycles. Therefore, using hot melts can be a technologically and economically interesting alternative for the assembly and packaging of MEMS.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ad65df519b131b143f2114a1656d02d8 https://doi.org/10.1007/s00542-006-0101-7 Zobrazit plný text záznamu Full text from SpringerLink