Thermal Material for PCB Substrate and Its Measurement Method

Autor:	Chi Chuan Wang, Ra Min Tain
Rok vydání:	2019
Předmět:	Measurement method Materials science Chemical engineering Thermal Substrate (printing) Electrical and Electronic Engineering
Zdroj:	Journal of The Japan Institute of Electronics Packaging. 22:205-208
ISSN:	1884-121X 1343-9677
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ad282e8ac670375ce512cc56c3b37e1d https://doi.org/10.5104/jiep.22.205 Zobrazit plný text záznamu