Effect of Wire Lifetime in Diamond Wire Wafering on the Wafer Roughness and Mechanical Strength
| Autor: | Jaeggi, C., DeMeyer, C., Wiedmer, F., Stierli, R., Simoncic, P., Assi, F., Wasmer, K. |
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| Jazyk: | angličtina |
| Rok vydání: | 2012 |
| Předmět: | |
| DOI: | 10.4229/27theupvsec2012-2av.4.48 |
| Popis: | 27th European Photovoltaic Solar Energy Conference and Exhibition; 1054-1059 Diamond wire wafering is considered to be the emerging technology for substituting SiC free abrasive slurry based technology for the cutting of monocrystalline silicon. This technology has attracted a large attention in recent years as it promises higher throughput, simpler processes and reduced production costs. Most investigations focused on the fundamental understanding of diamond wire cutting processes and its impact on the material properties e.g. wafers strength and surface topography. At present, very little is known about the effects of wire wear on the mechanical strength and the surface quality of produced wafers and thus on the wire lifetime. In the present study, results are shown from an initial experimental set up aimed at gaining knowledge about the effect of diamond wear and diamond wire type on the cutting behavior of silicon as well as the produced wafer quality. By slicing through three bricks in three consecutive cuts using the same wire, wafers were created with different conditions of wire wear. In this study, we looked at the impact of this wear to the mechanical strength and surface roughness of these wafers for wires from two suppliers. It was found that although the diamonds showed evident wear, no significant impact can be measured on the wafer strength as well as the wafer surface morphology for both studied wires. |
| Databáze: | OpenAIRE |
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