Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability

Autor:	Gihan Dodanduwa Waduge, Greg Baty, Young-woo Lee, Tae-Kyu Lee
Rok vydání:	2022
Předmět:	Materials Chemistry Electrical and Electronic Engineering Condensed Matter Physics Electronic Optical and Magnetic Materials
Zdroj:	Journal of Electronic Materials. 51:1169-1179
ISSN:	1543-186X 0361-5235
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::acaf72a280e3c1890cd9b71c46a20a6c https://doi.org/10.1007/s11664-021-09379-5 Zobrazit plný text záznamu Full text from SpringerLink