Integrated Fan‐Out (InFO) for High Performance Computing

Autor:	Doug C.H. Yu, John Yeh, Kuo‐Chung Yee, Chih Hang Tung
Rok vydání:	2021
Zdroj:	Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces. :95-124
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ac6ce2ed2058fc5432f893e539d6c765 https://doi.org/10.1002/9781119793908.ch4 Zobrazit plný text záznamu