Selective Deposition of Conductive Particles for Anisotropic Conductive Adhesive Interconnects

Autor:	Van Long Huynh, Knut Eilif Aasmundtveit, Hoang-Vu Nguyen
Rok vydání:	2022
Zdroj:	2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
DOI:	10.1109/estc55720.2022.9939469
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ac627279a086565e01d4ed64b310442c https://doi.org/10.1109/estc55720.2022.9939469 Zobrazit plný text záznamu