The effects of turmeric on the grain structure and properties of copper electrodeposited composites
| Autor: | John E. Graves, Richard James Merrill, Jamie Beddow, Liang Wu, Andrew J. Cobley, Elena Fuentes |
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| Rok vydání: | 2020 |
| Předmět: |
Materials science
020209 energy Composite number Metals and Alloys chemistry.chemical_element 02 engineering and technology Surfaces and Interfaces Condensed Matter Physics Microstructure Copper Surfaces Coatings and Films chemistry Mechanics of Materials 0202 electrical engineering electronic engineering information engineering Composite material Grain structure |
| Zdroj: | Transactions of the IMF. 98:328-335 |
| ISSN: | 1745-9192 0020-2967 |
| DOI: | 10.1080/00202967.2020.1827588 |
| Popis: | The objective of this research was to electrocodeposit turmeric particles into copper matrices, and assess the influence of turmeric on the microstructure and properties of those deposits. The inco... |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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