High Filled Epoxy Composites for Electronic Packaging Application

Autor:	Pei Leng Teh, K.N. Seetharamu, Hazizan Md Akil, K.S. Beh, A.N.R. Wagiman, M. Mariatti
Rok vydání:	2006
Předmět:	Composite epoxy material Thermogravimetric analysis Filler (packaging) Materials science Flexural strength visual_art visual_art.visual_art_medium Electronic packaging Substrate (electronics) Epoxy Composite material Diluent
Zdroj:	2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
ISSN:	1089-8190
DOI:	10.1109/iemt.2006.4456466
Popis:	Increasing demands in the electronic packaging industries have led to the need for high-performance organic substrate material like epoxy composites. High . This paper investigates the effect of ethanol as diluent in epoxy composites containing 0 to 60vol% of mineral silica. Flexural properties of epoxy composites were studied at room temperature. Thermal properties were studied using dilatomater, dynamic mechanical analyzer (DMA) and thermogravimetric analysis (TGA). In overall, the properties of the epoxy composites are depend on the filler loading and the addition of ethanol as diluent.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ac040da975d9495092e6642e87e2e2f2 https://doi.org/10.1109/iemt.2006.4456466 Zobrazit plný text záznamu