Compact 2D OPC modeling of a metal oxide EUV resist for a 7nm node BEOL layer
Autor: | Peter De Schepper, David Rio, Werner Gillijns, Joost Bekaert, Michael Greer, Michael Kocsis, Maxence Delorme, Anita Fumar-Pici, Adam Lyons, Sook Lee, Danilo De Simone, Wallow Thomas I, Jason K. Stowers |
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Rok vydání: | 2017 |
Předmět: |
Materials science
business.industry Extreme ultraviolet lithography Oxide 02 engineering and technology Photoresist 021001 nanoscience & nanotechnology 01 natural sciences 010309 optics Back end of line chemistry.chemical_compound Resist chemistry Extreme ultraviolet 0103 physical sciences Optoelectronics Node (circuits) 0210 nano-technology business Layer (electronics) |
Zdroj: | SPIE Proceedings. |
ISSN: | 0277-786X |
DOI: | 10.1117/12.2260441 |
Popis: | Inpria has developed a directly patternable metal oxide hard-mask as a high-resolution photoresist for EUV lithography1. In this contribution, we describe a Tachyon 2D OPC full-chip model for an Inpria resist as applied to an N7 BEOL block mask application. |
Databáze: | OpenAIRE |
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