Utilization of low-melting temperature alloy with confined seal for reducing thermal contact resistance
| Autor: | Po Hsiang Tseng, Chi-Chuan Wang, Wen Xiao Chu |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Thermal contact conductance
Materials science 020209 energy Alloy Energy Engineering and Power Technology chemistry.chemical_element Thermal grease 02 engineering and technology engineering.material Seal (mechanical) Industrial and Manufacturing Engineering 020401 chemical engineering chemistry Thermal 0202 electrical engineering electronic engineering information engineering engineering 0204 chemical engineering Composite material Tin Indium FOIL method |
| Zdroj: | Applied Thermal Engineering. 163:114438 |
| ISSN: | 1359-4311 |
| DOI: | 10.1016/j.applthermaleng.2019.114438 |
| Popis: | This paper investigates a novel design of thermal interface material (TIM) using low-melting temperature alloy (LMTA) with confined seal. For solid TIM like indium foil, the thermal contact resistance is reduced with the rise with contact pressure, and an apparent hysteresis phenomenon may occur during loading/unloading of contact pressure. For the solid-state TIM, the indium TIM outperforms those of copper, lead and tin TIMs. The molten LMTA can further reduce the thermal contact resistance, however, the overflow and dislocation problems are observed. Hence, a novel confined design by using LMTA with an annular metal seal is proposed that can completely prevent aforementioned problems. Yet the reliability of the novel TIM is also investigated after hundred thermal cycles. |
| Databáze: | OpenAIRE |
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