| Autor: |
Fan-Yi Ouyang, Pilin Liu, Shenquan Ou, Zezhong Fu, Goyal Deepak |
| Rok vydání: |
2009 |
| Předmět: |
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| Zdroj: |
ASME 2009 InterPACK Conference, Volume 1. |
| DOI: |
10.1115/interpack2009-89023 |
| Popis: |
Electromigation behavior of solder joints with thick Cu column was studied. The failure mechanisms for both SnPb and SnAg solder joints were discussed. To better understand the mechanisms, voids nucleation and propagation were also studied through Kelvin structure resistant monitoring and cross-sectional in-situ SEM observation. It was observed that package substrate process may play a role on how much portion of the life time that void nucleation and propagation could take respectively. Package warpage also played an important role on electromigration performance. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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