| Popis: |
Recent new or improved thermal analysis and thermal constants measurement techniques have been developed to evaluate, rapidly and accurately, thermal and related properties of materials available only in small quantities, including thin films, wafers and sheets. These innovative mostly transient techniques can also be used as thermal analysis tools. Measurements of thermal conductivity, thermal diffusivity, specific heat, thermal expansion and related properties by these methods have been undertaken on a variety of different materials. Results will be presented and discussed to illustrate the use of these techniques for characterization and evaluation purposes. Examples will include metals, ceramics, semiconductors, polymers, and amorphous and inorganic materials measured at different temperatures or ranges of temperature from below 10 K to above 1000 K. |
