Fast phase transformation due to electromigration of 18μm microbumps in three-dimensional integrated-circuit integration

Autor:	Yuan Wei Chang, Tao-Chih Chang, Chih Chen, Chau-Jie Zhan, Annie T. Huang, Jin-Ye Juang
Rok vydání:	2014
Předmět:	Materials science Mechanics of Materials Mechanical Engineering Soldering Phase (matter) Metallurgy Intermetallic Three-dimensional integrated circuit General Materials Science Condensed Matter Physics Electromigration
Zdroj:	Materials Letters. 137:136-138
ISSN:	0167-577X
Popis:	The electromigration behavior was investigated in 18-μm SnAg microbumps at 150 1C. The monitored resistance increase abruptly soon after the current stressing of 4.610 4 A/cm 2 was applied but the resistance rose much slower after a certain period of time. The formation of the high-resistivity Ni3Sn4 intermetallic compounds (IMCs) was responsible for the abrupt resistance increase in the beginning of the current stressing. The whole solder joint was transformed into an IMC joint. Because IMC has a higher electromigration resistance than the solder, a much slower increase in resistance was resulted after the solder joint was transformed into IMCs.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ab6c8c96c503ca446c54dd28dfe3a4a0 https://doi.org/10.1016/j.matlet.2014.08.156 Zobrazit plný text záznamu Full Text from ScienceDirect