Enhanced reliability considerations for manufacturability of space TR modules of Radar Imaging Payload

Autor:	Vinod S Chippalkatti, Rajashekhar C Biradar
Rok vydání:	2022
Zdroj:	2022 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON).
DOI:	10.1109/mapcon56011.2022.10047527
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ab3b5a31cf199ea1ce13a2e1d9f39908 https://doi.org/10.1109/mapcon56011.2022.10047527 Zobrazit plný text záznamu