A Comparison of AlGaN/GaN HFETs on Si Substrates in Ceramic Air Cavity and Plastic Overmold Packages

Autor:	Apurva Chaudhari, Sameer Singhal, Jerry W. Johnson, Andrew Edwards, C. Park, C. Snow, Kevin J. Linthicum, Robert Joseph Therrien, W. Nagy, Allen W. Hanson, Isik C. Kizilyalli
Rok vydání:	2007
Předmět:	Materials science Silicon business.industry Thermal resistance chemistry.chemical_element Gallium nitride Signal chemistry.chemical_compound Operating temperature chemistry visual_art Thermal visual_art.visual_art_medium Optoelectronics Ceramic Radio frequency business
Zdroj:	2007 IEEE/MTT-S International Microwave Symposium.
ISSN:	0149-645X
Popis:	AlGaN/GaN HFETs on Si substrates have been assembled in ceramic air cavity and plastic overmold packages. Thermal, DC, small and large signal RF and reliability characterization have been performed on both types of devices. Thermal characterization shows that the thermal resistance of the plastic overmolded parts is higher resulting in higher operating temperatures. The higher operating temperature causes parameters such as the peak CW power to be lower than that seen in the ceramic air cavity package. The advantage of the plastic packaging resides in its >10x lower package assembly cost.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ab38c43f3d937578f58e233433511bd6 https://doi.org/10.1109/mwsym.2007.379981 Zobrazit plný text záznamu