Printed Circuit Board Assembly Modeling for Predictive Reliability Assessment

Autor:	Iulia - Eliza Tinca, Iulian - Ionut Ailinei, Arjana Davidescu
Rok vydání:	2022
Zdroj:	2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME).
DOI:	10.1109/siitme56728.2022.9988304
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::aaf2ca565a2add17d9bb79127156eb6b https://doi.org/10.1109/siitme56728.2022.9988304 Zobrazit plný text záznamu