Novel cleaning solutions for polysilicon film post chemical mechanical polishing
| Autor: | Tan Fu Lei, W.H. Chang, Chih Peng Lu, Tien-Sheng Chao, Wen Lu Yang, Ming Chi Liaw, Ming Shih Tsai, Chao Chyi Chen, Tung-Ming Pan |
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| Rok vydání: | 2000 |
| Předmět: |
Aqueous solution
Materials science biology Inorganic chemistry biology.organism_classification Electronic Optical and Magnetic Materials carbohydrates (lipids) Metal Ammonium hydroxide chemistry.chemical_compound Pulmonary surfactant chemistry Impurity Chemical-mechanical planarization visual_art visual_art.visual_art_medium Tetra Chelation Electrical and Electronic Engineering |
| Zdroj: | IEEE Electron Device Letters. 21:338-340 |
| ISSN: | 1558-0563 0741-3106 |
| DOI: | 10.1109/55.847373 |
| Popis: | Novel cleaning solutions were developed for post-CMP process, surfactant tetra methyl ammonium hydroxide (TMAH) and/or chelating agent ethylene diamine tetra acetic acid (EDTA) were added into the diluted ammonium hydroxide (NH/sub 4/OH+H/sub 2/O) alkaline aqueous solution to enhance removal of metallic and organic contamination. From the experimental result, it is found that the particle and metal removal efficiency and the electrical characteristics are significantly improved for post-CMP cleaning. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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