Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era

Autor:	Kwang-Seong Choi, Jiho Joo, Gwang-Mun Choi, Ho-Gyeong Yun, Seok Hwan Moon, Ki-seok Jang, Chanmi Lee, Jin-Hyuk Oh, In-Seok Kye, Yoon-Hwan Moon, Yong-Sung Eom
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::aae1e772606cce0eecc6225c0b6a57eb https://doi.org/10.1109/ectc51906.2022.00042 Zobrazit plný text záznamu