Coupling modification of microstructure for improving the mechanical properties of Zn-Sn-Cu-Bi high-temperature solder
| Autor: | Xing Fei, Qiu Xiaoming, Cui Luo, Ruan Ye, Lu Yuzhen |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Equiaxed crystals Materials science Mechanical Engineering Metallurgy 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics Microstructure 01 natural sciences Grain size Matrix (geology) Mechanics of Materials Soldering 0103 physical sciences Ultimate tensile strength Coupling (piping) General Materials Science Composite material Elongation 0210 nano-technology |
| Zdroj: | Materials Letters. 181:42-46 |
| ISSN: | 0167-577X |
| Popis: | In this study, an attempt to investigate a coupling modification method for grain refinement in Zn-Sn-Cu-Bi (ZSCB) high-temperature solder has been made. During coupling modification, primary grains nucleated from CeZn5 sites and grew to form much more e-CuZn5 phases compared with the original solder. Peritectic η-Zn phases were also refined, transformed from matrix to equiaxed phases, with grain size of 1.40–2.24 µm and uniform elements distribution was achieved. By means of coupling modification, the mechanical properties of ZSCB high-temperature solder, the tensile strength and elongation, show indeed significantly improvement with an increase of 77.15% and 112.68%, respectively. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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