| Autor: |
Sang-Won Park, Ho Yeong Jeong, Jin-Ho Yoon, Se Young Jeong, Kisu Joo, Seung-Jae Lee, Byoung Woong Moon |
| Rok vydání: |
2021 |
| Předmět: |
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| Zdroj: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC). |
| DOI: |
10.1109/ectc32696.2021.00137 |
| Popis: |
We demonstrated the new strip-level EMI shielding process with a spray method. Test PKGs having dimension of 300um width and l, 200um height were fabricated to evaluate feasibility of strip-level EMI shielding. As a result, spray can coat the total area of trench inner side wall with the special spray coating material and optimized spray parameters. Moreover, we measured the near-field shielding effectiveness(SE) of sputtering and spray films. 5.9um-thick sputtering one and 5.4um-thick Ag ink sprayed were prepared and measured in near E- and H-field in the range of 30MHz∼1.5GHz. In E-field, The SE results showed 21dB at 800MHz and 55dB at 100MHz. In H-field, the SE result of 5.4um-thick Ag ink was 1∼2dB higher than 5.9um-thick Sus/Cu/Sus film. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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