Integrated Wafer and Die Level Simulation of Back End of Line Chemical Mechanical Polishing Processes

Autor:	Ushasree Katakamsetty, Stefan Nikolaev Voykov, Boris Vasilev, Sam Nakagawa, Tamba Tugbawa, Jansen Chee, Aaron Gower-Hall, Brian Lee, Weiyang Zhu, Bifeng Li, Kimiko Ichikawa
Rok vydání:	2023
Zdroj:	2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::a9d730bb1c08d2a22fd6f99ff721d780 https://doi.org/10.1109/edtm55494.2023.10103106 Zobrazit plný text záznamu