Measurements and simulation of SMT components
| Autor: | Cosme Furlong, Ryszard J. Pryputniewicz, David Rosato |
|---|---|
| Rok vydání: | 2003 |
| Předmět: |
Surface-mount technology
Interconnection Materials science Holography Electronic packaging Mechanical engineering Integrated circuit Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention law Thermal Electronic engineering Thermomechanical analysis Electrical and Electronic Engineering Thermal analysis |
| Zdroj: | Microelectronics International. 20:13-16 |
| ISSN: | 1356-5362 |
| DOI: | 10.1108/13565360310455463 |
| Popis: | Integrity of surface mount technology (SMT) components depends on their response to temperature changes caused by operating conditions. Temperature induced differential thermal expansions lead to strains in the interconnection structures of active devices. To evaluate these strains, temperature profiles of the interconnected components must be known. In this paper, a methodology for developing thermal models of SMT components is presented using thermal analysis system (TAS) and its application is demonstrated by simulating thermal fields of a representative package. Then, thermomechanical deformations of the package are measured quantitatively using state‐of‐the‐art laser‐based optoelectronic holography (OEH) methodology. |
| Databáze: | OpenAIRE |
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