Analysis of nanobridge tests
| Autor: | Jianrong Li, Wing Kin Chan, Yong Wang, Shengyao Zhang, Tong-Yi Zhang |
|---|---|
| Rok vydání: | 2010 |
| Předmět: |
Materials science
business.industry Mechanical Engineering technology industry and agriculture Computational Mechanics Physics::Optics Modulus Substrate deformation Substrate (electronics) Structural engineering Bending Deformation (meteorology) Finite element method stomatognathic system Mechanics of Materials Adhesive Composite material business Test data |
| Zdroj: | Acta Mechanica Solida Sinica. 23:283-296 |
| ISSN: | 0894-9166 |
| DOI: | 10.1016/s0894-9166(10)60031-6 |
| Popis: | This paper analyzes nanobridge tests with consideration of adhesive contact deformation, which occurs between a probe tip and a tested nanobeam, and deformation of a substrate or template that supports the tested nanobeam. Analytical displacement-load relation, including adhesive contact deformation and substrate deformation, is presented here for small deformation of bending. The analytic results are confirmed by finite element analysis. If adhesive contact deformation and substrate deformation are not considered in the analysis of nanobridge test data, they might lead to lower values of Young's modulus of tested nanobeams. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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