| Autor: |
Alexander A. Trusov, Andrei M. Shkel, Sergei A. Zotov, Igor P. Prikhodko, Brenton R. Simon, Gunjana Sharma |
| Rok vydání: |
2013 |
| Předmět: |
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| Zdroj: |
International Symposium on Microelectronics. 2013:000705-000710 |
| ISSN: |
2380-4505 |
| DOI: |
10.4071/isom-2013-wp42 |
| Popis: |
We report vacuum packaging procedures for low-stress die attachment and versatile hermetic sealing of resonant MEMS. The developed in-house infrastructure allows for both high and moderate-level vacuum packaging addressing the requirements of various applications. Prototypes of 100 μm silicon-on-insulator Quadruple Mass Gyroscopes (QMGs) were packaged using the developed process with and without getters. Characterization of stand-alone packaged devices with no getters resulted in stable quality factors (Q-factors) of 1000 (corresponding to 0.5 Torr vacuum level), while devices sealed with activated getters demonstrated Q-factors of 1.2 million (below 0.1 mTorr level inside the package). Due to the high Q-factors achieved in this work, we project that the QMG used in this work can potentially reach the navigation-grade performance, potentially bridging the gap between the inertial silicon MEMS and the state-of-the-art fused quartz hemispherical resonator gyroscopes. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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