High Density Thin Film Flex Technology for Advanced Packaging Applications
Autor: | Kai Zoschke, Hermann Oppermann, Markus Wohrmann, Christine Kallmayer, Christian Tschoban, Kevin Krohnert, Christina Lopper, Danny Jaeger, Mario Lutz, Olaf Wunsch |
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Rok vydání: | 2022 |
Zdroj: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). |
Databáze: | OpenAIRE |
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