Molybdenum copper based ultrathin two-phase heat transport system for high power-density gallium nitride chips

Autor:	Cheng Fang, Feiyu Zheng, Ben Chu, Weizheng Cheng, Huaixin Guo, Huanbei Chen, Ruize Wang, Chengyi Song, Peng Tao, Wen Shang, Benwei Fu, Tao Deng
Rok vydání:	2022
Předmět:	Energy Engineering and Power Technology Industrial and Manufacturing Engineering
Zdroj:	Applied Thermal Engineering. 211:118458
ISSN:	1359-4311
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::a856deb980ef4bd954191174308884b9 https://doi.org/10.1016/j.applthermaleng.2022.118458 Zobrazit plný text záznamu Full Text from ScienceDirect