| Autor: |
Yun-Tsung Li, Hsun-Fa Li, Chien-Wen Chien, Ching-Shan Chien |
| Rok vydání: |
2018 |
| Předmět: |
|
| Zdroj: |
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). |
| DOI: |
10.1109/impact.2018.8625744 |
| Popis: |
Voids in solder joints are considered one of main defects in Printed Circuit Board Assemblies (PCBAs). The reason for the formation of solder voids is mainly caused by the organic volatile matter in the flux of solder paste that cannot effused timely during the reflow process. During the reflow process, the flux has been consumed and decomposed; resulting in the amount of outgassing flux gets entrapped in the solder. In this study, we used Taguchi Methods to estimate factors which like PCB materials and surface finished, pad design, reflow profile, stencil aperture and solder paste, then come out the optimized parameters to reduce the solder voids for Light Emitting Diode (LED). |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
