Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn−9Zn solder alloy and interfacial properties of Cu/solder/Cu joints
| Autor: | Guangmin Sheng, Guoji Zhao, Yanxia Jing, Guang-hua Wen |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Chemical substance Materials science Alloy Metallurgy Metals and Alloys General Engineering 02 engineering and technology engineering.material 021001 nanoscience & nanotechnology Microstructure 01 natural sciences law.invention Magazine law Soldering 0103 physical sciences engineering 0210 nano-technology Science technology and society Mass fraction Joint (geology) |
| Zdroj: | Journal of Central South University. 23:1831-1838 |
| ISSN: | 2227-5223 2095-2899 |
| DOI: | 10.1007/s11771-016-3237-3 |
| Popis: | Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd (mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn solder alloy were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn-9Zn-0.1Pr(/Nd) alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn-Zn-RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn-9Zn-0.1Pr(/Nd) solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn-9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr. |
| Databáze: | OpenAIRE |
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