Electrical resistivity, wear map and modeling of extruded tungsten reinforced copper composite

Autor:	S.C. Vettivel, N. Selvakumar, A. Haiter Lenin, N. Leema
Rok vydání:	2014
Předmět:	Materials science chemistry Electrical resistivity and conductivity Scanning electron microscope Powder metallurgy Metallurgy Delamination Composite number chemistry.chemical_element Tungsten Composite material Tribology Copper
Zdroj:	Materials & Design (1980-2015). 56:791-806
ISSN:	0261-3069
DOI:	10.1016/j.matdes.2013.11.070
Popis:	The present work includes the effect of W addition in improving the properties of Cu with the help of high-energy mechanical alloying. Composite preforms of (5–15 W) with copper were fabricated by Powder Metallurgy (P/M) method. The preforms were sintered at 850 °C, subsequently the furnace was cooled and again the specimens were hot extruded to get 92% preform density. Four point probe tester, Scanning Electron Microscope, Energy Dispersive Spectrum and pin on-disc system were used to evaluate electrical conductivity, characterization and tribological property of Cu–W composite respectively. The various stages in dominant oxidation and delamination wear mechanism was clearly discussed. The wear rate and coefficient of friction decreased with increase in load and sliding distance. Design expert software was used to develop contour map, mathematical model and useful conclusions were made.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::a77068fba859562111a9560a1ad32dc4 https://doi.org/10.1016/j.matdes.2013.11.070 Zobrazit plný text záznamu Full Text from ScienceDirect