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"Z" technology FPA architectures offer many advantages over planar technologies, stemming from the much larger electronics real estate available for signal conditioning and processing. 'ecause it is an unconventional architecture for FPAs, producibility of Z-plane technology has frequently been called into question. The HYMOSS® Z-plane technology is now used to package computer electronics and will soon enter high volume production for that family of applications. FPA applications will benefit as well as a result of lowered cost, higher reliability, and available productiAl capacity. In addition, new electronic capabilities will continue to accrue from the incorporation of digital processing and sophisticated interconnect technology. The transition to high volume production is described and the ramifications for FPA manufacturing are identified. |
