The effects of ultrasonic vibration on mechanical properties of tungsten particle-reinforced copper-matrix composites
| Autor: | Chieh Kung, Te-Tan Liao, Chun Ta Chen |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
Materials science
Composite number Metallurgy Metals and Alloys Sintering chemistry.chemical_element 02 engineering and technology Tungsten Industrial and Manufacturing Engineering 020501 mining & metallurgy 0205 materials engineering chemistry Plating Powder metallurgy Copper plating Deposition (phase transition) Particle |
| Zdroj: | Canadian Metallurgical Quarterly. 56:450-458 |
| ISSN: | 1879-1395 0008-4433 |
| Popis: | W-Cu micro-powder mixtures usually have poor sinterability due to the relatively low solubility of W in both solid and liquid Cu. In fabricating W-Cu composites, an electroless copper plating process is often used to coat Cu on the W particle surface prior to the sintering process. Due to their small size W particles tend to agglomerate during the plating process, hence the individual particle may not be properly coated with Cu. In this study, ultrasonic vibration is applied in the electroless plating process to break up the agglomerations and restrain the powders from gathering, ensuring a uniform deposition of the Cu on individual W particle. W-Cu composite samples containing pure Cu and 6, 9 and 12 wt-% of Cu-coated W particles, respectively, are fabricated using a standard powder metallurgy technique. It is shown that the application of ultrasonic vibration in the activation and deposition steps of the electroless copper plating process prevents W powder agglomeration and ensures that each W p... |
| Databáze: | OpenAIRE |
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