High-aspect-ratio Sub-2-μm Vias Using Thermal Imprint with Build-up Resin
| Autor: | Tamura Mamoru, Takuya Ohashi, Hiroyuki Kuwae, Yuki Usui, Jun Mizuno, Takahiro Kishioka, Takumi Kamibayashi, Shuichi Shoji |
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| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Plasma etching Fabrication Materials science Silicon chemistry.chemical_element Thermosetting polymer 020206 networking & telecommunications 02 engineering and technology 01 natural sciences law.invention chemistry law Etching (microfabrication) 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Deep reactive-ion etching Photolithography Composite material Electroplating |
| Zdroj: | 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). |
| DOI: | 10.1109/impact.2018.8625825 |
| Popis: | We developed a fabrication method of high-aspect-ratio fine vias with a build-up resin. The build-up resin composed of a thermosetting resin and silica fillers has low coefficient of thermal expansion and low dielectric constant. Thermal imprint was performed to form the high-aspect-ratio fine via holes on the build-up resin. The imprint mold with high-aspect-ratio fine pillar patterns was fabricated by photolithography and deep reactive ion etching. The residual layer consisted of the thermosetting resin and the silica filler was removed by O 2 /CHF 3 plasma etching. The via of 1.2 µm in diameter with aspect ratio of 5.5, and 5.0 µm in pitch was successfully fabricated followed by Au electroplating. The proposed fabrication method is applicable for high-density 3-dimensional and 2.5-dimensional integration technologies. |
| Databáze: | OpenAIRE |
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