Facilitating strong interfacial bonding of immiscible Nb/Cu system using consumable Ti interlayer

Autor:	Yongqiang Deng, Mengen Liu, Li Bai
Rok vydání:	2022
Předmět:	Materials science Brittleness Interfacial bonding Chemical engineering Bonding strength Diffusion Intermetallic Substrate (electronics) Condensed Matter Physics Instrumentation Layer (electronics) Diffusion bonding Surfaces Coatings and Films
Zdroj:	Vacuum. 196:110782
ISSN:	0042-207X
DOI:	10.1016/j.vacuum.2021.110782
Popis:	A novel consumable Ti interlayer strategy was developed to facilitate strong interfacial bonding between Nb and immiscible Cu by diffusion bonding at 850 °C. Bonding mechanisms of forming Ti–Cu intermetallic compounds (IMCs) at initial stage and subsequently eradicating IMCs upon diffusion induced Ti dilution were elucidated. IMCs free Nb/Cu joint composed of a Nb–Cu interdiffusion layer slightly alloyed with Ti was obtained at bonding duration of 40 min. Excellent bonding strength comparable to Cu substrate properties was achieved in 40 min joint attributed to building of metallurgical bonding at the interface and absence of brittle phases.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::a63a1a5c06508cf7f392816557a0c111 https://doi.org/10.1016/j.vacuum.2021.110782 Zobrazit plný text záznamu Full Text from ScienceDirect