Mixed convection in an inclined channel with heated porous blocks
| Autor: | H. Kahalerras, N. Guerroudj |
|---|---|
| Rok vydání: | 2012 |
| Předmět: |
Materials science
Buoyancy Applied Mathematics Mechanical Engineering Reynolds number Mechanics engineering.material Nusselt number Computer Science Applications symbols.namesake Mechanics of Materials Combined forced and natural convection Heat transfer engineering Fluid dynamics symbols Boussinesq approximation (water waves) Porous medium |
| Zdroj: | International Journal of Numerical Methods for Heat & Fluid Flow. 22:839-861 |
| ISSN: | 0961-5539 |
| DOI: | 10.1108/09615531211255743 |
| Popis: | PurposeThe purpose of this paper is to study numerically the fluid flow and heat transfer in an inclined channel provided with heated porous blocks on its lower plate.Design/methodology/approachThe Brinkman‐Forchheimer extended Darcy model with the Boussinesq approximation is adopted for the flow in the porous regions. The governing equations with the appropriate boundary conditions are solved by the control volume method. The effect of some pertinent parameters such as the buoyancy force intensity, the porous blocks shape and height, the porous medium permeability and the Reynolds number are analyzed for various inclination angles ranging from −90° to +90°.FindingsThe results reveal, essentially, that the inclination angle of the channel can alter substantially the fluid flow and heat transfer mechanisms, especially at high Richardson and Darcy numbers. In this case, the maximum and minimum global Nusselt numbers are reached for α=+90° and α=−90°, respectively.Research limitations/implicationsThe results obtained in this work are valid for an inclined channel with porous blocks attached on the heated parts of the lower plate, whereas the upper wall is thermally insulated.Practical implicationsThe results obtained in this worky can be used in the thermal control of electronic components. The use of porous blocks mounted on the heat sources will increase the rate of heat removal in order to maintain the electronic components at an acceptable operating temperature.Originality/valueThe paper provides an interesting method to improve the cooling of electronic devices by use of a porous medium. |
| Databáze: | OpenAIRE |
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