Characterization and computational modeling of electrical wires and wire bundles subject to bending loads
| Autor: | Zhengdi Wang, Yitong Zhou, Sai Siddhartha Vemula, Soheil Soghrati, Marcelo J. Dapino, Hossein Qarib, Kushal Gargesh, Ehsan Taghipour, Leon M. Headings |
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| Rok vydání: | 2018 |
| Předmět: |
Imagination
Work (thermodynamics) Materials science business.industry Mechanical Engineering media_common.quotation_subject 02 engineering and technology Structural engineering Bending 021001 nanoscience & nanotechnology Condensed Matter Physics Finite element method Characterization (materials science) 020303 mechanical engineering & transports 0203 mechanical engineering Mechanics of Materials Bundle General Materials Science Deformation (engineering) 0210 nano-technology business Material properties Civil and Structural Engineering media_common |
| Zdroj: | International Journal of Mechanical Sciences. 140:211-227 |
| ISSN: | 0020-7403 |
| Popis: | A reduced-order finite element (FE) model is introduced for modeling the mechanical behavior of taped electrical wire bundles subject to bending loads, which can be used for digital manufacturing applications. We show that incorporating the plastic behavior of wires in this model is crucial to the accurate prediction of the deformed shape. A customized cantilever bending test is presented to quantify the force-deflection response of single wires and taped wire bundles and evaluate their homogenized elastoplastic properties using an optimization-based algorithm. A high-fidelity 3D FE model is also introduced, which can be used as a substitute for experimental testing. It is shown that after proper characterization of effective material properties, a 1D FE model can accurately predict the deformation response of a taped wire bundle subject to bending loads. Both 1D and 3D FE simulations presented in this work are validated with experimental data. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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