| Autor: |
Mike Tsai, Jensen Tsai, Simon Chen, Ryan Chiu, J. Y. Chen, Shunyu Jian, Eric He, Yu-Po Wang, Frank Chu |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC). |
| DOI: |
10.1109/eptc47984.2019.9026564 |
| Popis: |
Recently, the high growing semiconductor is the Internet of Things (IoT) and fifth generation (5G) connectivity application. Based on 5G, the different working frequency between sub 6GHz and millimeter wave (mmWave) frequency range on 28GHz and 39GHz, both systems provide good networking coverage in the city. The mmWave antenna is designed by array antenna to beamforming the Radio frequency signal to the networking devices to achieve high speed data transmission requirement. The system in package (SiP) could integrate various heterogeneous components such as antenna in package (AiP) to get small form factor and high electrical performance. The electromagnetic interference (EMI) is very critical which can damage electronic devices and equipment. To meet the high frequency of electrical performancents, the partition EMI shielding has provided the signal isolation between different function blocks such as digital, analog and RF antenna devices in SiP module. In this paper, a test vehicle is designed to evaluate the shielding effectiveness (SE) by vector network analyzer (VNA). The different partition EMI shielding method and study will proceed and measure under mmWave frequency of 22GHz to 40GHz. The reliability verification of EMI shielding on advanced SiP module will utilize standard JEDEC test condition including Temperature Cycle Test (TCT), High Temperature Storage (HTS), unbias-high accelerated stress test (u-HAST) results to verify the package structure. Finally, this paper will demonstrate the advanced SiP with EMI shielding solutions for future 5G Connectivity devices application. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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