SiC Fan-out Wafer Level Package for High Power Application

Autor:	Piotr Mackowiak, Olaf Wittler, Tanja Braun, Kolia Erbacher, Michael Schiffer, Martin Schneider-Ramelow
Rok vydání:	2022
Zdroj:	2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::a4f09327e4a0034f70271a32e666bc1b https://doi.org/10.1109/eptc56328.2022.10013212 Zobrazit plný text záznamu