| Autor: |
Chad C. Terwilliger, Katerina Rousseva, Matthew John Dejneka, Lars Brusberg, Jason R. Grenier |
| Rok vydání: |
2021 |
| Předmět: |
|
| Zdroj: |
Optical Interconnects XXI. |
| Popis: |
Co-packaged optics for next-generation data center switches require novel photonic packaging and optical interconnect solutions to increase bandwidth and decrease manufacturing costs. An optoelectronic glass substrate with integrated ion-exchanged (IOX) single-mode waveguides for photonic integrated circuit (PIC) packaging and fiber cable connectivity is demonstrated in an effort to reduce the overall packaging complexity. The single-mode glass waveguides were fabricated and evaluated to be thermally stable at 110oC for more than 5 years. Laser singulated optical end-facets and laser-formed passive alignment features yield an average connector loss of 0.68 dB when end-coupled to standard MTP- 16™ connectors. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
