Effect of Cu(I) ion on electrodeposition of zinc from ChCl-urea deep eutectic solvent
| Autor: | Li Yan, Yi-xin Hua, Hai Liu, Qibo Zhang, Cunying Xu, Mengting Huang, Xiang Wang, Shuxian Wang, Xiangyu Ren |
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| Rok vydání: | 2020 |
| Předmět: |
Materials science
Inorganic chemistry Nucleation chemistry.chemical_element 02 engineering and technology Zinc 010402 general chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics Electrochemistry 01 natural sciences Redox 0104 chemical sciences Ion Deep eutectic solvent chemistry.chemical_compound chemistry General Materials Science Electrical and Electronic Engineering Cyclic voltammetry 0210 nano-technology Deposition (law) |
| Zdroj: | Journal of Solid State Electrochemistry. 24:1175-1184 |
| ISSN: | 1433-0768 1432-8488 |
| DOI: | 10.1007/s10008-020-04608-z |
| Popis: | The effect of Cu(I) ions on the electrodeposition of zinc from ChCl-urea-ZnO deep eutectic solvent (DES) was investigated through electrochemical measurement and the deposit characterization. The cyclic voltammetry and cathodic polarization analyses demonstrated that Cu(I) ions obviously decreased the nucleation potential of Zn(II) and promoted the Zn(II) reduction reaction. The analysis of the chronoamperometric transients indicated that the nucleation and growth mode of Zn deposition changed from a three-dimensional progressive nucleation to three-dimensional instantaneous nucleation in the presence of Cu(I) ions. The addition of Cu(I) ions was observed to change the surface morphology, purity, and crystallographic orientation of the zinc deposits. |
| Databáze: | OpenAIRE |
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