Chip-on-Board (CoB) technology for low temperature environments. Part I: Wire profile modeling in unencapsulated chips
| Autor: | Sanka Ganesan, Sharon Ling, D. Schatzel, K. K. Jinka, Abhijit Dasgupta, Andrew A. Shapiro |
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| Rok vydání: | 2007 |
| Předmět: |
Engineering
Interconnection Wire bonding Offset (computer science) business.industry Electronic packaging Elastic energy Mechanical engineering Integrated circuit Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention law Electronic engineering Boundary value problem Electrical and Electronic Engineering Safety Risk Reliability and Quality business Parametric statistics |
| Zdroj: | Microelectronics Reliability. 47:1246-1250 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2006.08.019 |
| Popis: | An analytical model based on elastic strain energy minimization is developed for estimating the wire profile in unencapsulated ball-wedge wire bond configuration for chip-on-board (CoB) technology. The wire profile is applicable to ball-wedge bonds with a height offset, and is modeled using a piece-wise continuous polynomial function (cubic spline) with appropriate boundary conditions at the two bond sites. Plastic deformation is ignored in the current analysis as a first-order approximation, since the interest is in parametric sensitivity studies. The model is useful for estimating the wire profile for different offset heights and wire spans, and serves as a starting point for subsequent thermomechanical stress analysis after encapsulation. Parametric studies are presented to explore the wire profile for different CoB geometries. |
| Databáze: | OpenAIRE |
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