Unprecedented atomic surface of silicon induced by environmentally friendly chemical mechanical polishing

Autor: Xiangxiang Cui, Zhenyu Zhang, Shiqiang Yu, Xin Chen, Chunjing Shi, Hongxiu Zhou, Fanning Meng, Jiaxin Yu, Wei Wen
Rok vydání: 2023
Předmět:
Zdroj: Nanoscale.
ISSN: 2040-3372
2040-3364
DOI: 10.1039/d3nr01149f
Popis: Schematic diagram of the CMP polishing mechanism for silicon.
Databáze: OpenAIRE