Aluminum, Titanium Boride, and Nitride Films Sputter-Deposited from Multicomponent Alloy Targets Studied by XPS
| Autor: | Emmanuel C. Onyiriuka |
|---|---|
| Rok vydání: | 1993 |
| Předmět: |
Materials science
010401 analytical chemistry Metallurgy Alloy Oxide chemistry.chemical_element Mineralogy Nitride Sputter deposition engineering.material 01 natural sciences 0104 chemical sciences 010309 optics chemistry.chemical_compound X-ray photoelectron spectroscopy chemistry Sputtering 0103 physical sciences engineering Thin film Tin Instrumentation Spectroscopy |
| Zdroj: | Applied Spectroscopy. 47:35-37 |
| ISSN: | 1943-3530 0003-7028 |
| DOI: | 10.1366/0003702934048488 |
| Popis: | X-ray photoelectron spectroscopy (XPS or ESCA), combined with argonion sputter depth profiling, has been employed for the characterization of aluminum, titanium boride, and nitride films deposited by dc-magnetron sputtering from multicomponent alloy targets. The XPS results show that metallic Al, TiB2, and TiN films are formed by this method. However, depth profile results indicated substantial oxide contamination as high as 30 atomic % throughout the bulk of the films. Given the gross oxide contamination, multicomponent alloy target materials appear to be unsuitable for producing high-quality metal/metallic films for applications where electrical conductivity is a critical requirement. |
| Databáze: | OpenAIRE |
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