Evolution of the Creep Behavior for SAC305 Lead Free Solder Exposed to Various Thermal Profiles

Autor:	S M Kamrul Hasan, Mohammad Al Ahsan, Jeffrey C. Suhling, Pradeep Lall
Rok vydání:	2022
Zdroj:	2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
DOI:	10.1109/itherm54085.2022.9899502
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::a3dc4caf05375cd592f84e57ee8c433a https://doi.org/10.1109/itherm54085.2022.9899502 Zobrazit plný text záznamu