Semiconductor wafer bonding via liquid capillarity

Autor:	Z. L. Liau
Rok vydání:	2000
Předmět:	Wire bonding Materials science Physics and Astronomy (miscellaneous) Wafer bonding business.industry Nanotechnology Elasticity (physics) Gallium arsenide Surface tension chemistry.chemical_compound Semiconductor chemistry Anodic bonding Wafer Composite material business
Zdroj:	Applied Physics Letters. 77:651-653
ISSN:	1077-3118 0003-6951
DOI:	10.1063/1.127074
Popis:	Liquid surface tension has been used to pull different semiconductor wafers to very close contact and strong bonding. Bonded wafers, such as GaAs/GaP, were heat treated without pressure application to achieve wafer fusion. The bonding process has been analyzed, and criteria for surface tension, wafer flatness, and elasticity have been derived.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::a3b7cb61deff56f589087a1eb0be3781 https://doi.org/10.1063/1.127074 Zobrazit plný text záznamu