A Technique for Contactless Copper Electrodeposition for 3D Packaging Applications

Autor:	C. Weber, Roman Gouk, Rajesh Balachandran, Zach Patterson, Manish Keswani, Steven Verhaverbeke
Rok vydání:	2014
Předmět:	Fuel Technology Materials science chemistry Metallurgy Materials Chemistry Electrochemistry chemistry.chemical_element Copper
Zdroj:	ECS Electrochemistry Letters. 3:D41-D43
ISSN:	2162-8734 2162-8726
DOI:	10.1149/2.0031410eel
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::a3a2d0703457671e03759eb1809c4886 https://doi.org/10.1149/2.0031410eel Zobrazit plný text záznamu