Direct Power Board Bonding Technology for 3D Power Module Package
| Autor: | Ayumi Minamide, Murata Daisuke, Hodaka Rokubuichi, Asaji Nobuhiro, Morisaki Shota, Ishibashi Hidetoshi, Hiroshi Yoshida |
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| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Computer science business.industry 05 social sciences Electrical engineering ComputerApplications_COMPUTERSINOTHERSYSTEMS Stray inductance 01 natural sciences Renewable energy Inductance Printed circuit board Robustness (computer science) Power module 0103 physical sciences Miniaturization 0501 psychology and cognitive sciences Home appliance business 050104 developmental & child psychology |
| Zdroj: | 2019 International Conference on Electronics Packaging (ICEP). |
| DOI: | 10.23919/icep.2019.8733451 |
| Popis: | Power module is used in a wide range of fields such as, home appliance, industry, railway, automobile, renewal energy, and so on. Recently, it is increasing to be required miniaturization of footprint and higher reliability to power modules. This paper introduces the new package technology has the Power board (thicker copper printed circuit board) as inner connection instead of the conventional wire connection. This technology leads further downsizing, lower package stray inductance, and robustness to answer the market requirements. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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