The properties of epoxy resin coated silica fillers composites
| Autor: | A.N.R. Wagiman, K.S. Beh, Hazizan Md Akil, K.N. Seetharamu, Pei Leng Teh, M. Mariatti, C.K. Yeoh |
|---|---|
| Rok vydání: | 2007 |
| Předmět: |
chemistry.chemical_classification
Filler (packaging) Materials science Flexural modulus Mechanical Engineering Electronic packaging Polymer Epoxy Condensed Matter Physics Thermal expansion Composite epoxy material Substrate (building) chemistry Mechanics of Materials visual_art visual_art.visual_art_medium General Materials Science Composite material |
| Zdroj: | Materials Letters. 61:2156-2158 |
| ISSN: | 0167-577X |
| DOI: | 10.1016/j.matlet.2006.08.036 |
| Popis: | Epoxy resin coated silica fillers composites with high percentage of filler loading, such as 80 to 95 vol.% are able to be produced by a mechanical mixing technique. The advantages of high filler loading of theses materials are noted from the thermal and flexural modulus. Apparently, the materials exhibit low coefficient of thermal expansion (CTE) at as low as or below 10 ppm/°C and high flexural modulus of above 20 GPa. In general, these promising characteristics fulfill the requirement to be used as substrate materials in electronic packaging applications. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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