Advanced Materials for High Temperature, High Performance, Wide Bandgap Power Modules
| Autor: | Brandon Passmore, Richard Lollar, Ross Liederbach, Jennifer Stabach, Chad B. O'Neal, B. McPherson, Brad McGee |
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| Rok vydání: | 2015 |
| Předmět: |
010302 applied physics
Materials science Passivation Dielectric strength High voltage 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Engineering physics Electronic Optical and Magnetic Materials Potting Power electronics Power module 0103 physical sciences Materials Chemistry Breakdown voltage Power semiconductor device Electrical and Electronic Engineering 0210 nano-technology |
| Zdroj: | Journal of Electronic Materials. 45:245-254 |
| ISSN: | 1543-186X 0361-5235 |
| DOI: | 10.1007/s11664-015-4187-5 |
| Popis: | Advanced packaging materials must be utilized to take full advantage of the benefits of the superior electrical and thermal properties of wide bandgap power devices in the development of next generation power electronics systems. In this manuscript, the use of advanced materials for key packaging processes and components in multi-chip power modules will be discussed. For example, to date, there has been significant development in silver sintering paste as a high temperature die attach material replacement for conventional solder-based attach due to the improved thermal and mechanical characteristics as well as lower processing temperatures. In order to evaluate the bond quality and performance of this material, shear strength, thermal characteristics, and void quality for a number of silver sintering paste materials were analyzed as a die attach alternative to solder. In addition, as high voltage wide bandgap devices shift from engineering samples to commercial components, passivation materials become key in preventing premature breakdown in power modules. High temperature, high dielectric strength potting materials were investigated to be used to encapsulate and passivate components internal to a power module. The breakdown voltage up to 30 kV and corresponding leakage current for these materials as a function of temperature is also presented. Lastly, high temperature plastic housing materials are important for not only discrete devices but also for power modules. As the operational temperature of the device and/or ambient temperature increases, the mechanical strength and dielectric properties are dramatically reduced. Therefore, the electrical characteristics such as breakdown voltage and leakage current as a function of temperature for housing materials are presented. |
| Databáze: | OpenAIRE |
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