| Autor: |
Lee Chai Ying, Kunjapat Mugunan, Cheong Choke Fei |
| Rok vydání: |
2018 |
| Předmět: |
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| Zdroj: |
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT). |
| DOI: |
10.1109/iemt.2018.8511783 |
| Popis: |
Analysis of semiconductor packages with stacked dies poses a great challenge when assessing the die attach integrity of the different dies. With multiple interfaces already existing within the package it becomes even more difficult if the individual dies are bonded using different die attach material e.g. solder for the Base Chip and glue for the Top Chip. Typically the non-destructive test employed by most of the failure analysis labs to detect delamination for such kind of packages is by using Scanning Acoustic Microscopy in Transmission Mode (Thru-Scan). This non-invasive technique transmits ultrasound through the sample and reveals delamination at all interfaces in a single scan. However with this mode there is no way to determine which interface is delaminated. Furthermore the degree of spatial resolution for this mode is also rather poor. Verification of the Thru-Scan results is normally carried out by performing a mechanical cross-section across the delaminated region to identify the affected interface. The work presented in this paper focuses on an alternative non-destructive method using the Reflection Mode (C-SAM) to verify the delamination detected by the Transmission Mode Thru-Scan by progressively scanning from the bottom of the package across each of the interfaces within the package to identify the exact location of the defect. Various destructive tests were subsequently performed to validate this alternative method. The results show not only the effectiveness of this method in determining the correct interface that was affected but the Reflective Mode scanning also proves that it can reveal defects which are not able to be detected by the Transmission Mode Thru-Scan. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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